Apple is looking for the best options to give us 5G enabled iPhones as soon as possible, and it seems that Intel will be the company to go to
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This year's iPhone devices will be faster than last year's iPhone X and even faster than most of the competition with 7nm A12 chip processors
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The 7nm-based Apple A12 processor expected to power those three next-gen iPhones in the fall has reportedly entered mass production at TSMC. Meanwhile, Samsung is getting close to manufacturing its own 7nm chip for 2019 flagship Androids.
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A super-early Huawei Mate 20 prototype may have already been benchmarked at AnTuTu, racking up an earth-shattering 356,000+ points with a 7nm-based Kirin 980 SoC inside.
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Samsung, the makers of Qualcomm's Snapdragon 845, 835, 821 and 820 processors, could lose the Snapdragon 855 production contract to bitter rivals TSMC.
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Geekbench tells us that multi-core scores on an iPhone 8 or iPhone X beat those of a Mid-2017 13-inch MacBook Pro. This, one analyst says, is ridiculous.
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Both the Kirin 970 for the Huawei Mate 10 and the Apple A11 for the fall's new iPhones are being made with 10nm fabrications.
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One of the reasons Apple needed so much time to launch the long-rumored 10.5-inch iPad Pro is likely this super-small TSMC-made A10X SoC.
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Samsung, which produced the Snapdragon 820, 821 and 835, will not produce the 845. TSMC, which has been pushing for 7nm fabs, is on the case.
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The Galaxy S8 will use either the Snapdragon 835 or the Exynos 8895 chipset, depending on the region. Samsung isn't making enough of them.
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The chipset is finally getting ready for mass production and just in time, too. There's going to be a swell of demand for a pricey iPhone 8.
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All of these chipsets that will be in smartphones from every big name manufacturer this year use a 10nm fabrication that hasn't worked out at factories.
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Unless Apple is altogether giving up on the long-struggling tablet market, which seems unlikely, a number of new iPads must be right around the corner, considering this fall’s unusual lack of activity on that front.
But the Cupertino-based tech giant’s reliance on the world’s largest dedicated independent semiconductor foundry might end up costing it a precious few extra months. Unfortunately, it sounds like TSMC’s sizzling hot 10nm chips won’t be ready for primetime (read mass production) very soon, making it impossible to launch 10.5 (or 10.9), 9.7 and/or 7.9-inch 2017 iPad upgrades as early as March.
It’s probably too late to source A10X processors from a different supplier as well, or go back to the drawing board and use an older, larger node. Besides, Samsung is reportedly facing its own batch of 10nm yield problems, even forcing Qualcomm to settle for a 14nm fabrication process as far as the next-gen mid-end Snapdragon 660 is concerned.
That’s still a major step forward from the SD650’s 28nm roots, with the 10nm-powered Snapdragon 835 likely capable of sticking to its original release timetable. Back to Apple, a TSMC-made 10nm A11 SoC has been widely rumored to exclusively find its way inside next year’s iPhone 8 (and presumably, the 7s and 7s Plus too), but by summer, you can definitely count on a happy end to “lower-than-expected” yield rates.
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Samsung believed in Qualcomm after the Snapdragon 810 flop, helping shape up the SD820 SoC which the Galaxy S7 then used in the US and China as opposed to the entirely homebrewed Exynos 8890. Now it’s the semiconductor specialist’s turn to return the favor, trusting in the chaebol’s advanced, industry-first 10nm FinFET technology, despite Samsung’s very full plate that could interfere with the production and release schedule of the Snapdragon 835 processor.
Forget 830, 825 or 823 naming speculation. The SD820 and 821’s H1 2017 sequel is something special, and the Snapdragon 835 moniker perfectly reflects its many notable improvements.
Unfortunately, Qualcomm only confirms a considerably “smaller chip footprint, giving OEMs more usable space inside upcoming products to support larger batteries or slimmer designs.” We’re told to expect “significant improvements in battery life”, while Samsung’s 10-nanometer die shrink theoretically allows “up to a 30% increase in area efficiency with 27% higher performance or up to 40% lower power consumption” compared to 14nm chips like the 820 and 821.
It’s important to note the Snapdragon 835 isn’t explicitly said to boost energy efficiency and raw speed by 30 or 40 percent, with details of that nature, as well as a CPU core count, frequency, GPU specs, memory or wireless capabilities coming later on, as we approach the vague “first half of 2017” commercial launch deadline.
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