The first Android smartphones powered by Qualcomm's hot new Snapdragon 710 processor will apparently be released by the end of the quarter, possibly supporting various "premium" technologies at an affordable price point.
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Samsung, the makers of Qualcomm's Snapdragon 845, 835, 821 and 820 processors, could lose the Snapdragon 855 production contract to bitter rivals TSMC.
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Following in the footsteps of the 435, Qualcomm's hot new Snapdragon 450 processor is based on a 14nm FinFET process, improving power and efficiency.
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Samsung's disappointment with Qualcomm's TSMC partnership for the Snapdragon 845 shouldn't deprive the Galaxy S9 from the best possible SoC.
The post Samsung still wants TSMC’s Snapdragon 845 inside Galaxy S9, in-house 6nm move planned for 2019 appeared first on Pocketnow.
In anticipation of Qualcomm’s relatively vague Snapdragon 835 announcement a couple of weeks back, MediaTek similarly unveiled its own very first 10nm-based mobile processor in late September without giving everything away in terms of specifications and especially commercial release dates.
But now the Taiwanese fabless semiconductor company is essentially going back to refresh the 20nm-designed Helio X20 family. While also destined for high-end smartphone use, these new “benchmark-setting” MediaTek Helio X23 and X27 SoCs are obviously no matches for the SD835-contending X30 when it comes to both raw speed and energy efficiency.
They do however promise “more than a 20% overall processing improvement” compared to the Helio X20 and X25 respectively, despite the X27, for instance, very marginally upping the clock speed ante of its two top-shelf ARM Cortex-A72 cores from 2.5 to 2.6GHz.
The ARM Mali GPU also gains a puny 25MHz for a grand total of 875, with both the Helio X23 and X27’s CPUs rocking Tri-Cluster Deca-core architecture composed of an A72 duo, and a couple of A53 quartets at different velocity.
Dual camera photography with an “upgraded MediaTek Imagiq image signal-processing solution”, MiraVision EnergySmart Screen power-saving technology, and Envelope Tracking Module for “further power-efficiency” are touted as important Helio X27 and X23 enhancements as well. Unfortunately, all we know about smartphones powered by the two new chipsets is that they’re coming “soon.” No names, no dates, no nothing.
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